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Piesia Embedded Solutions: A robust foundation empowering intelligent terminals for the Internet of

2026-01-16
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Piesia Embedded Solutions: A robust foundation empowering intelligent terminals for the Internet of

I. Core Positioning of the Solution

Piesia focuses on the core demands of embedded systems: "lightweight deployment, long-term stability, and flexible expansion."  Based on the product philosophy of "dual-platform hardware matrix + full-scenario interface coverage + industrial-grade reliable design," we create embedded solutions. The solution uses embedded motherboards, core boards, and mini industrial PCs as core carriers, covering Intel x86 and domestic Phytium/Allwinner and other multi-architecture platforms. It deeply integrates key technologies such as low-power computing, multi-protocol interconnection, and harsh environment adaptation, and is widely used in industrial control, IoT terminals, smart devices, and automotive electronics, providing integrated embedded system support from hardware customization to software adaptation for various industries.

II. Core Products and Technological Advantages

1. Multi-architecture computing matrix to adapt to differentiated needs

• Intel x86 platform: Equipped with 10th/12th generation Core and Celeron series processors and AMD Embedded Turin architecture chips, supporting 8-192 core flexible expansion, with 1.6 times higher throughput and 1.3 times higher energy efficiency compared to the previous generation. It can meet the needs of complex logical operations and multi-task parallel processing, and is suitable for high-performance scenarios such as industrial control and edge computing;

• Domestic platform: Based on industrial-grade processors such as Phytium Tenglong E2000Q and Allwinner T153, it adopts a 4-core Cortex-A7 + independent RISC-V E907 multi-core heterogeneous architecture, precisely matching the dual needs of "real-time control + efficient computing," and is compatible with Kylin and Tongxin domestic systems, achieving independent and controllable core hardware and systems;

• Low-power optimization design: Supports dynamic processor power adjustment, with standby power consumption as low as 5W. Some products use fanless cooling solutions, suitable for embedded terminal scenarios with limited power (such as outdoor sensors and portable devices).

2. Comprehensive Interface Coverage for Seamless Device Interconnection

• Industrial Interconnection Interfaces: Integrates 3-6 Gigabit Ethernet ports (supporting RMII/RGMII) and 2-4 CAN-FD ports (compatible with CAN2.0A/B), enabling "industrial switch-level" networking without external expansion chips, suitable for interconnecting devices such as PLCs, smart meters, and robots;

• Sensing and Control Interfaces: Provides 24 12-bit GPADC channels, 30 PWM channels, 10 UART channels, and multi-channel GPIO, enabling precise acquisition of analog signals such as temperature and pressure, and driving actuators such as servo motors and frequency converters, suitable for industrial automation control scenarios;

• Multimedia and Expansion Interfaces: Integrates MIPI-DSI, LVDS, and RGB display interfaces (supporting up to 1920×1200@60fps), a 4-lane MIPI-CSI interface supporting dual camera input, and supports PCIe 4.0 and M.2 expansion, compatible with AI inference modules, 5G modules, storage expansion cards, and other peripherals.

3. Industrial-Grade Reliable Design for Long-Term Stable Operation

• Adaptation to Harsh Environments: Operating temperature range of -40℃~85℃, passing rigorous electromagnetic compatibility (EMI) and electrostatic discharge (ESD) tests, employing fully sealed protection and heat pipe cooling design, dustproof, waterproof, and corrosion-resistant, suitable for complex environments such as high-temperature workshops, outdoor terminals, and mining equipment;

• Long-Term Supply Guarantee: Adhering to the 10+ year lifecycle commitment for industrial chips, providing 10-15 years of stable supply, avoiding equipment iteration costs due to chip discontinuation, and meeting the long-term service needs of embedded devices;

• Data Security Protection: Built-in TrustZone and Secure Boot security mechanisms, integrated national cryptographic algorithm IP (SM2/SM3/SM4), supporting TPM2.0 encryption module expansion, preventing firmware tampering and data leakage, suitable for sensitive scenarios such as financial terminals and power monitoring. 4. Lightweight Deployment, Reducing Development and Operation & Maintenance Costs

• Compact Size Design: The embedded motherboard has a minimum size of only 100x72mm, and the core board uses a stamp-hole + LGA connector design, supporting 35mm DIN rail mounting or embedded integration, allowing it to be embedded in space-constrained terminal devices (such as smart meters and in-vehicle terminals);

• Simplified Development Process: Supports the Yocto framework and DPDK/SPDK kits, provides a complete set of technical documentation including baseboard schematics, pin multiplexing tables, and test routines, and is compatible with multiple operating systems such as Linux, Windows IoT, and VxWorks, enabling developers to quickly complete driver porting and application development;

• Remote Management Capabilities: Integrates Intel vPro and AMT remote management technologies, supporting remote diagnosis, firmware updates, and configuration adjustments, reducing on-site service frequency by 80% and lowering cross-regional operation and maintenance costs.

5. Flexible Customization Services to Meet Personalized Needs

• Hardware Customization: Interface types, storage capacity, power consumption control, and form factor can be customized according to customer needs, supporting personalized adjustments of logo and interface layout during mass production;

• Software Adaptation: Provides services such as operating system tailoring, driver development, and application optimization, and is compatible with third-party software such as Halcon, OpenCV, and industrial control protocol stacks, ensuring overall system compatibility and operating efficiency.

III. Typical Application Scenarios

1. Industrial PLC Control Scenario

• Application Requirements:  Requires motor speed control, real-time sensor data acquisition, and multi-device collaborative control, with a response delay of <1ms, and support for multiple industrial protocols.

• Core Hardware: Piesia domestically produced embedded core board (Allwinner T153 architecture);

• Application Highlights: The RISC-V core focuses on real-time logic operations, the Cortex-A7 core handles data processing and communication management, integrates 3 Gigabit Ethernet ports + 2 CAN-FD ports, supports PROFINET and Modbus protocols. After deployment in an automated factory, production cycle time increased by 20%, and equipment failure rate decreased by 30%;

• Core Value: Replaces traditional PLC controllers, achieving integrated "control + computing + communication," reducing equipment integration costs, and improving control accuracy and stability.

2. IoT Edge Terminal Scenario

• Application Requirements: Requires collecting massive amounts of sensor data, performing local data preprocessing and edge computing, supporting 5G/WiFi remote uploading, and adapting to low-power operation in outdoor environments;

• Core Hardware: Piesia low-power mini industrial PC (Intel Celeron platform);

• Application Highlights: Standby power consumption is only 5W, supports 4G/5G expansion, local data processing delay <50ms, can connect to 100+ sensors. After deployment in a smart agriculture project, data transmission bandwidth usage decreased by 60%, and equipment battery life was extended by 3 times;

• Core Value: Achieves "local data processing + cloud collaboration," reducing network bandwidth pressure and improving the response speed and reliability of the IoT system.

3. In-Vehicle Intelligent Terminal Scenario

• Application Requirements: Requires support for in-vehicle navigation, multimedia entertainment, vehicle condition monitoring, and connected vehicle communication; requires shock resistance, wide operating temperature range, and low power consumption.

• Core Hardware: Piesia automotive-grade embedded motherboard (AMD Embedded Turin platform);

• Application Highlights: Operating temperature range of -40℃ to 75℃, passed automotive vibration testing (10-2000Hz), integrated CAN/LIN bus interface and 4G/5G module, supports GPS/Beidou dual-mode positioning, data read/write latency <10ms;

• Core Value: Provides integrated hardware support for in-vehicle scenarios, ensuring stable operation under complex road conditions, and empowering the upgrade of intelligent connected vehicles.

4. Smart Metering Scenario

• Application Requirements: Requires energy data acquisition, metering analysis, and remote communication; requires compact size, low power consumption, and long-term stable operation;

• Core Hardware: Piesia miniature embedded motherboard (Phytium Tenglong E2000Q platform);

• Application Highlights: Dimensions of only 120x80mm, power consumption <8W, integrated 2-way RS485 and 1-way Ethernet, supports power protocols (DL/T645), data acquisition accuracy reaches 0.1 level, and after deployment in a power monitoring project, the meter reading success rate increased to 99.9%;

• Core Value: Replaces traditional meter hardware solutions, enabling intelligent and networked upgrades, reducing operation and maintenance costs and data errors.

IV. Core Value of the Solution

1. Multi-scenario adaptability: Dual-platform architecture + full interface coverage, adapting to diverse scenarios such as industrial control, IoT, in-vehicle systems, and smart devices, meeting differentiated computing power and functional requirements;

2. Industrial-grade reliability: Wide temperature range protection, shock and interference resistance, and a 10+ year supply cycle ensure long-term stable operation of embedded devices 7x24 hours a day, with system availability reaching 99.99%;

3. Independent and controllable: Complete adaptation of domestically produced platforms, independent research and development of core hardware and systems, support for national cryptographic algorithms and security protection, meeting the security needs of critical areas;

4. Cost reduction and efficiency improvement: Lightweight deployment reduces installation space, simplified development process shortens project cycles, and remote maintenance reduces on-site service costs by 80%;

5. Flexible customization: Providing personalized customization services for hardware interfaces, dimensions, and software systems, quickly responding to customers' specific needs.

V. Service Guarantee

As an Intel Platinum Partner and a national high-tech enterprise, Piesia has 20 years of experience in industrial embedded hardware R&D, providing full-process services from hardware customization, driver development, system debugging to long-term supply. A professional technical team provides 7x24 hour response, combined with a nationwide service network, to provide customers with dual guarantees of "localized rapid support + remote technical guidance". At the same time, we deeply cooperate with mainstream software vendors and module suppliers in the industry to provide integrated "hardware + software + peripherals" package services, helping customers quickly realize product implementation and iterative upgrades.


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Shenzhen Piesia Electronic Technology Co., Ltd.
1-4F,Building N, Xinwei Third Industrial Zone,Xinshi Community, Dalang Street, Longhua District,ShenZhen
Tel: 086 189 2676 2372
Fax: 086 0755-8372 6889
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